Design Engineer

Description:

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

As a Senior or Principal Power module Engineer as part of the IGBT group you play a vital part of TeamNexperia. You will be working on meaningful technologies that touch every aspect of modern life taking end to end responsibility. This is your opportunity to become an essential part of a growing global team doing ground-breaking work using leading-edge technologies in IGBT development. On top of a competitive salary and benefits package, you will enjoy support, guidance, training, tools, and real opportunities for meaningful growth—professionally, personally, and socially.

What You Will Do

As a Power Module Engineer at Nexperia you will have the opportunity to build module technology platforms for IGBT and or SiC MOSFET design and process development. This is an opportunity to work in any of our UK, European or Shanghai locations. You will be responsible for the tooling, fixture and automation design from an early development stage. You will be involved in the design package outline, DBC layout, lead frame and wire bonding diagrams as well as the power circuit design, chip selection design, reliability and failure analysis ensuring the product is kept competitive in the current market. This role will also involve working on a customized module technical scheme, create the 3D structure according to requirements, export engineering drawings, along with verifying and optimising the structure of module parts.

This position can be based in Manchester (UK), Hamburg (Germany) or Shanghai (China).

What You Will Need To Know

• Master’s degree or above, Major in power electronics, material engineering, microelectronics, electrical engineering or equivalent experience
• As a Senior or Principal level engineer you will need 6-10+ years’ experience in power module design, CAD modelling, finite element simulation
• You will need to be familiar with packaging process, design and verification methods (e.g. vacuum soldering, low temperature Ag sintering, wire bonding, lead bonding, planar packaging)
• You will need skills in power module development machine test process, and part design
• Knowledge of the challenges of advanced module design/ processing and the requirements of new materials
• Understanding of semiconductor device fabrication and assembly technology, also with knowledge in semiconductor device physics
• Strong English speaking and writing skills
• Leadership and motivational skills

Desirable:

• Experience in SiC module design and process is preferred
• Device Physics experience in IGBT and /OR SiC MOSFET